What Does BGA Stand For?

BGA stands for Ball Grid Array Electronic Packaging

BGA, or Ball Grid Array Electronic Packaging, is a type of surface-mount technology used for connecting semiconductor devices to circuit boards. It features an array of solder balls arranged in a grid pattern under the package, facilitating efficient thermal and electrical performance. BGA packaging allows for a higher density of connections, enabling smaller and more complex electronic designs, while improving reliability and manufacturability in various applications, including consumer electronics, automotive, and telecommunications.

Other Meanings for BGA