What Does CMP Stand For?
CMP stands for Chemical Mechanical Polishing
CMP, or Chemical Mechanical Polishing, is a surface finishing process widely used in the semiconductor and microelectronics industries. It combines chemical and mechanical actions to achieve a planar surface on wafers and other substrates. The process involves applying a slurry containing chemical agents and abrasive particles to facilitate the removal of thin layers of material, resulting in a smooth and defect-free surface. CMP is crucial for enhancing the performance and reliability of electronic components by ensuring precise layer thickness and uniformity in fabrication processes.
Added on 14th April 2008 | Last edited on 17th June 2025 | Edit Acronym