What Does PECVD Stand For?

PECVD stands for Plasma Enhanced Chemical Vapor Deposition

PECVD, or Plasma Enhanced Chemical Vapor Deposition, is a thin-film deposition technique that utilizes plasma to enhance chemical reactions at lower temperatures. This process allows for the deposition of various materials, including silicon-based films and dielectrics, on substrates with complex geometries. PECVD is widely used in semiconductor manufacturing, photovoltaic devices, and protective coatings due to its ability to produce uniform and high-quality films with controlled properties.