What Does UBM Stand For?
UBM stands for Under Bump Metallurgy
Under Bump Metallurgy (UBM) refers to a specialized surface metallurgical process utilized in the electronics industry, particularly in the fabrication of advanced packaging solutions. This technique involves the deposition of a metal layer beneath a bump, typically made of solder, to enhance electrical connectivity and mechanical reliability in semiconductor devices. UBM plays a critical role in ensuring effective heat dissipation and improving the performance and longevity of integrated circuits by providing a robust interface between the chip and the package.
Added on 14th April 2008 | Last edited on 16th June 2025 | Edit Acronym